15-18 June, 2017
Beijing Conference Center, China
20th International Seminar on Paste and Thickened Tailings
 19 December, 2016
 Abstract Submission Due

 12 February, 2017
 Full Paper Submission Due

 16 April, 2017
 Early Bird Registration Due


International Seminar on Paste Backfill in China (ISPBC) was initiated by Research Center of Paste Backfill and Mining, University of Science and Technology Beijing (USTB). The Seminar commenced in 2013 and will be continued every two years.

On 4-6 November 2013, the first seminar was held in Beijing. 300 delegates from 5 countries attended the seminar shared the achievement and improvement of paste technology in China and other countries. Six themes were covered in 20 presentations. The whole event went smoothly due to the well-prepared organizing committee and the participants had a great time both in the seminar and the dinner.

Beijing, 2013

Changsha, 2015

The second Seminar took place on 6-9 November 2015, in Changsha. More than 400 people attended this meeting and in the 33 presentations, more than 60% came from practitioners. After the seminar, participants spoke highly of this event and appreciated the services of the organizing committee and the content of the presentations.